Радиаторы

    Фото Партномер Производитель Datasheet Описание Кол-во Заказать
    325705B00000G

    Радиаторы Extruded Collar Style Heatsink for TO-5, Radial Fins, Vertical Mounting, 60 n Thermal Resistance, Black Anodized, 6.35mm
    325705R00000G

    Радиаторы Board Level Extruded Heatsink for TO-5, Cylindrical, Press Fit, Aluminum, Red Anodized, 12.70mm OD, 6.35mm Height
    326005B00000G

    Радиаторы Extruded Collar Style Heatsink for TO-5, Radial Fins, Vertical Mounting, 57 n Thermal Resistance, Black Anodized, 9.53mm
    326005R00000G

    Радиаторы Board Level Heatsink for TO-5, Vertical Mounting, 12.7×12.7×9.52mm
    335224B00034G

    Радиаторы Heatsink for Plastic BGA Packages, Black Anodized, 25x25x9.9mm, IC Pkg Size = 25 x 25, Tape #34
    335314B00000G

    Радиаторы BGA Heatsink, Bi-Directional, Black Anodized, 27x27x11mm, IC Pkg Size = 27 x 27, Epoxy
    335314B00032G

    Радиаторы BGA Heatsink, Bi-Directional, Black Anodized, 27x27x11mm, IC Pkg Size = 27 x 27, Metal, Tape #32
    335714B00000G

    Радиаторы BGA Heatsink, Bi-Directional, Black Anodized, 30x30x7mm, IC Pkg Size = 30 x 30, Epoxy
    335724B000032

    Радиаторы BGA Heatsink
    335814B00000G

    Радиаторы BGA Heatsink, Bi-Directional, Black Anodized, 30x30x9mm, IC Pkg Size = 30 x 30, Epoxy
    335824B00034G

    Радиаторы Heatsink for Plastic BGA Packages, Black Anodized, 30x30x9.4mm, IC Pkg Size = 31 x 31, Tape #34
    341600F00000G

    Радиаторы Thin-Fin Stamped Heatsink for PCI/AGP Chip Sets, Low Profile, Copper, 50.8×12.7×12.7mm
    341700F00000G

    Радиаторы Thin-Fin Board Level Heatsink for PCI/AGP Chip Sets, Thin Fin, Horizontal Mounting, Copper, 12.7×76.2×0.33mm
    341800F00000G

    Радиаторы Thin-Fin Board Level Heatsink for PCI/AGP Chip Sets, Thin Fin, Copper, Horizontal/Vertical Mounting, 19.1×76.2×0.33mm
    341900F00000G

    Радиаторы Thin-Fin Board Level Stamped Heatsink for PCI/AGP Chip Sets, Thin Fin, Copper, Horizontal/Vertical Mounting, 25.4×76.2×0.33mm
    342000F00000G

    Радиаторы Thin-Fin Stamped Heatsink for PCI/AGP Chip Sets, Low Profile, Copper, 101.6×25.4×25.4mm
    342100F00000G

    Радиаторы Thin-Fin Heatsink for PCI/AGP Chip Sets, Low Profile, Copper, 101.6×38.1×38.1mm
    364424B00032G

    Радиаторы Heatsink for Metal/Ceramic BGA Packages, Black Anodized, 40.1x40x11.4mm, IC Pkg Size = 40 x 40, Tape #32
    371824B00000G

    Радиаторы BGA Pin Fin Heatsink, Epoxy Attachment, Black Anodized, 35x35x7mm, 2.03mm Thickness
    371824B00032G

    Радиаторы Heatsink for Metal/Ceramic BGA Packages, Black Anodized, 35x35x7mm, IC Pkg Size = 35 x 35, Tape #32
    371824B00034G

    Радиаторы Heatsink for Plastic BGA Packages, Black Anodized, 35x35x7mm, IC Pkg Size = 35 x 35, Tape #34
    371924B00032G

    Радиаторы Heatsink for Plastic BGA, FPGA Packages, Black Anodized, 35x35x14mm, T405R Chomerics Tape for Metal Surfaces
    372924M02000G

    Радиаторы BGA Push Pin Heatsink with Attachment, 37.4×37.4x6mm, Green Anodized, 32.6 n Thermal Resistance, IC Pkg Size = 37.5 x 37.5, Plastic Pins, No Pad
    373024B00034G

    Радиаторы Heatsink for Plastic BGA Packages, Black Anodized, 27.9×27.9×8.9mm, IC Pkg Size = 28 x 28, Tape #34
    373324M00032G

    Радиаторы Heatsink for Metal/Ceramic BGA Packages, Green Anodized, 37.4×37.4x6mm, IC Pkg Size = 37.5 x 37.5, Tape #32